Wire bonding work at CERN

Ejemplares similares

• Wire bonding of the MCM multi chip module using 25 micron wire at CERN.
  por: Saba, A
  Publicado: (2006)
• ALICE ladder mounted and wire bonded on prototype bus
  Publicado: (2002)
• In the photograph, one can see the interconnection from one readout chip to the flexible cable realized with ultrasonic wire bonds (25 microns).
  por: Saba, A
  Publicado: (2006)
• Hybrid bonding on K&S manual bonder
  por: Alessandro, B.
  Publicado: (2004)
• Alice Silicon Strip Detector, HAL bonding tool
  por: xxx, x
  Publicado: (2002)