Cargando…
Technology development of p-type microstrip detectors with radiation hard p-spray isolation
A technology for the fabrication of p-type microstrip silicon radiation detectors using p-spray implant isolation has been developed at CNM-IMB. The p-spray isolation has been optimized in order to withstand a gamma irradiation dose up to 50 Mrad (Si), which represents the ionization radiation dose...
Autores principales: | , , , , , , |
---|---|
Lenguaje: | eng |
Publicado: |
2006
|
Materias: | |
Acceso en línea: | https://dx.doi.org/10.1016/j.nima.2006.07.005 http://cds.cern.ch/record/2635129 |
Sumario: | A technology for the fabrication of p-type microstrip silicon radiation detectors using p-spray implant isolation has been developed at CNM-IMB. The p-spray isolation has been optimized in order to withstand a gamma irradiation dose up to 50 Mrad (Si), which represents the ionization radiation dose expected in the middle region of the SCT-Atlas detector of the future Super-LHC during 10 years of operation. The best technological options for the p-spray implant were found by using a simulation software package and dedicated calibration runs. Using the optimized technology, detectors have been fabricated in the Clean Room facility of CNM-IMB, and characterized by reverse current and capacitance measurements before and after irradiation. The average full depletion voltage measured on the non-irradiated detectors was $V_{\rm{FD}} = 41 \pm 3$ V, while the leakage current density for the microstrip devices at $V_{\rm{FD}} + 20$ V was 400 nA/cm$^2$. |
---|