Effect of Isothermal Annealing on Sn Whisker Growth Behavior of Sn0.7Cu0.05Ni Solder Joint

This paper presents an assessment of the effect of isothermal annealing of Sn whisker growth behavior on the surface of Sn0.7Cu0.05Ni solder joints using the hot-dip soldering technique. Sn0.7Cu and Sn0.7Cu0.05Ni solder joints with a similar solder coating thickness was aged up to 600 h in room temp...

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Detalles Bibliográficos
Autores principales: Hashim, Aimi Noorliyana, Salleh, Mohd Arif Anuar Mohd, Ramli, Muhammad Mahyiddin, Abdullah, Mohd Mustafa Al Bakri, Sandu, Andrei Victor, Vizureanu, Petrica, Sandu, Ioan Gabriel
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10003934/
https://www.ncbi.nlm.nih.gov/pubmed/36902968
http://dx.doi.org/10.3390/ma16051852

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10003934/
https://www.ncbi.nlm.nih.gov/pubmed/36902968
http://dx.doi.org/10.3390/ma16051852

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