Macro–Mesoscale Modeling of the Evolution of the Surface Roughness of the Al Metallization Layer of an IGBT Module during Power Cycling

One of the main failure modes of an insulated-gate bipolar transistor (IGBT) module is the reconstruction of an aluminum (Al) metallization layer on the surface of the IGBT chip. In this study, experimental observations and numerical simulations were used to investigate the evolution of the surface...

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Detalles Bibliográficos
Autores principales: An, Tong, Zheng, Xueheng, Qin, Fei, Dai, Yanwei, Gong, Yanpeng, Chen, Pei
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10004039/
https://www.ncbi.nlm.nih.gov/pubmed/36903051
http://dx.doi.org/10.3390/ma16051936

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10004039/
https://www.ncbi.nlm.nih.gov/pubmed/36903051
http://dx.doi.org/10.3390/ma16051936

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