A Hierarchically Structured Graphene/Ag Nanowires Paper as Thermal Interface Material

With the increase in heat power density in modern integrating electronics, thermal interface materials (TIM) that can efficiently fill the gaps between the heat source and heat sinks and enhance heat dissipation are urgently needed owing to their high thermal conductivity and excellent mechanical du...

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Detalles Bibliográficos
Autores principales: Lv, Le, Ying, Junfeng, Chen, Lu, Tao, Peidi, Sun, Liwen, Yang, Ke, Fu, Li, Yu, Jinhong, Yan, Qingwei, Dai, Wen, Jiang, Nan, Lin, Cheng-Te
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Communication
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10005576/
https://www.ncbi.nlm.nih.gov/pubmed/36903671
http://dx.doi.org/10.3390/nano13050793

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10005576/
https://www.ncbi.nlm.nih.gov/pubmed/36903671
http://dx.doi.org/10.3390/nano13050793

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