Thermal and Mechanical Characterization of Epoxy/Polyimide Blends via Postcuring Process

In this study, the effects of polyimide (PI) content and postcuring on thermal and mechanical properties in PI and epoxy (EP) blending systems were investigated. EP/PI (EPI) blending reduced the crosslinking density and improved the flexural and impact strength due to ductility. On the other hand, i...

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Detalles Bibliográficos
Autores principales: Lee, Yong-Min, Kim, Kwan-Woo, Kim, Byung-Joo
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10007675/
https://www.ncbi.nlm.nih.gov/pubmed/36904313
http://dx.doi.org/10.3390/polym15051072

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10007675/
https://www.ncbi.nlm.nih.gov/pubmed/36904313
http://dx.doi.org/10.3390/polym15051072

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