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Structure Performance Correlation of N-Heterocyclic Oligomer Leveler for Acid Copper Plating of Advanced Interconnects
Levelers, as an essential part of organic additives in copper electroplating, play a crucial role in the fabrication of sophisticated interconnects in integrated circuits, packaging substrates, and printed circuit boards. In this work, four N-heterocyclic oligomers were synthesized and characterized...
Autores principales: | , , , , , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2023
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10051102/ https://www.ncbi.nlm.nih.gov/pubmed/36985756 http://dx.doi.org/10.3390/molecules28062783 |