Analysis of Degradation of Electromigration Reliability of Au-Al and OPM Wire Bonded Contacts at 250 °C Using Resistance Monitoring Method

The ongoing trend towards miniaturization and increased packaging density has exacerbated the reliability problem of Au-Al heterogeneous metal bonding structures in high-temperature environments, where extreme temperatures and high current pose a serious challenge. In order to address this issue, th...

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Detalles Bibliográficos
Autores principales: Li, Xueqin, Gao, Linchun, Ni, Tao, Zhou, Jingnan, Li, Xiaojing, Li, Yifan, Xu, Lida, Wang, Runjian, Zeng, Chuanbin, Li, Bo, Luo, Jiajun, Li, Jing
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10051239/
https://www.ncbi.nlm.nih.gov/pubmed/36985047
http://dx.doi.org/10.3390/mi14030640

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10051239/
https://www.ncbi.nlm.nih.gov/pubmed/36985047
http://dx.doi.org/10.3390/mi14030640

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