Cargando…
Advanced Electronic Packaging Technology: From Hard to Soft
| Autores principales: | , |
|---|---|
| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2023
|
| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10051394/ https://www.ncbi.nlm.nih.gov/pubmed/36984224 http://dx.doi.org/10.3390/ma16062346 |
| _version_ | 1785014875634794496 |
|---|---|
| author | Gu, Yue Huo, Yongjun |
| author_facet | Gu, Yue Huo, Yongjun |
| author_sort | Gu, Yue |
| collection | PubMed |
| description | |
| format | Online Article Text |
| id | pubmed-10051394 |
| institution | National Center for Biotechnology Information |
| language | English |
| publishDate | 2023 |
| publisher | MDPI |
| record_format | MEDLINE/PubMed |
| spelling | pubmed-100513942023-03-30 Advanced Electronic Packaging Technology: From Hard to Soft Gu, Yue Huo, Yongjun Materials (Basel) Editorial MDPI 2023-03-15 /pmc/articles/PMC10051394/ /pubmed/36984224 http://dx.doi.org/10.3390/ma16062346 Text en © 2023 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). |
| spellingShingle | Editorial Gu, Yue Huo, Yongjun Advanced Electronic Packaging Technology: From Hard to Soft |
| title | Advanced Electronic Packaging Technology: From Hard to Soft |
| title_full | Advanced Electronic Packaging Technology: From Hard to Soft |
| title_fullStr | Advanced Electronic Packaging Technology: From Hard to Soft |
| title_full_unstemmed | Advanced Electronic Packaging Technology: From Hard to Soft |
| title_short | Advanced Electronic Packaging Technology: From Hard to Soft |
| title_sort | advanced electronic packaging technology: from hard to soft |
| topic | Editorial |
| url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10051394/ https://www.ncbi.nlm.nih.gov/pubmed/36984224 http://dx.doi.org/10.3390/ma16062346 |
| work_keys_str_mv | AT guyue advancedelectronicpackagingtechnologyfromhardtosoft AT huoyongjun advancedelectronicpackagingtechnologyfromhardtosoft |