Ion-Induced Lateral Damage in the Focused Ion Beam Patterning of Topological Insulator Bi(2)Se(3) Thin Films

Focused Ion Beam patterning has become a widely applied technique in the last few decades in the micro- and nanofabrication of quantum materials, representing an important advantage in terms of resolution and versatility. However, ion irradiation can trigger undesired effects on the target material, most of them related to the damage created by the impinging ions that can severely affect the crystallinity of the sample, compromising the application of Focused Ion Beam to the fabrication of micro- and nanosized systems. We focus here on the case of Bi(2)Se(3), a topological material whose unique properties rely on its crystallinity. In order to study the effects of ion irradiation on the structure of Bi(2)Se(3), we irradiated with Ga(+) ions the full width of Hall-bar devices made from thin films of this material, with the purpose of inducing changes in the electrical resistance and characterizing the damage created during the process. The results indicate that a relatively high ion dose is necessary to introduce significant changes in the conduction. This ion dose creates medium-range lateral damage in the structure, manifested through the formation of an amorphous region that can extend laterally up to few hundreds of nanometers beyond the irradiated area. This amorphous material is no longer expected to behave as intrinsic Bi(2)Se(3), indicating a spatial limitation for the devices fabricated through this technique.