Mechanical Reliability Assessment of a Flexible Package Fabricated Using Laser-Assisted Bonding

The aim of this study was to develop a flexible package technology using laser-assisted bonding (LAB) technology and an anisotropic solder paste (ASP) material ultimately to reduce the bonding temperature and enhance the flexibility and reliability of flexible devices. The heat transfer phenomena du...

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Detalles Bibliográficos
Autores principales: Le, Xuan-Luc, Le, Xuan-Bach, Hwangbo, Yuhwan, Joo, Jiho, Choi, Gwang-Mun, Eom, Yong-Sung, Choi, Kwang-Seong, Choa, Sung-Hoon
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10051732/
https://www.ncbi.nlm.nih.gov/pubmed/36985008
http://dx.doi.org/10.3390/mi14030601

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10051732/
https://www.ncbi.nlm.nih.gov/pubmed/36985008
http://dx.doi.org/10.3390/mi14030601

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