The Study of the Reliability of Complex Components during the Electromigration Process

With the increasing number of inputs and outputs, and the decreasing interconnection spacing, electrical interconnection failures caused by electromigration (EM) have attracted more and more attention. The electromigration reliability and failure mechanism of complex components were studied in this...

Descripción completa

Detalles Bibliográficos
Autores principales: Cui, Hao, Tian, Wenchao, Zhang, Yiming, Chen, Zhiqiang
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10051856/
https://www.ncbi.nlm.nih.gov/pubmed/36984906
http://dx.doi.org/10.3390/mi14030499

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10051856/
https://www.ncbi.nlm.nih.gov/pubmed/36984906
http://dx.doi.org/10.3390/mi14030499

Ejemplares similares