Enhancing Wettability of Cu(3)P/Cu Systems through Doping with Si, Sn, and Zr Elements: Insights from First Principles Analysis

Explaining the wetting mechanism of Cu–P brazing materials and Cu remains challenging. This fundamental research aims to reveal the wettability mechanism of Si, Sn, and Zr doping on the interfacial bond strength of the Cu(3)P/Cu system through the first principles study. We carried out several sets...

Descripción completa

Detalles Bibliográficos
Autores principales: Yu, Shimeng, Cheng, Fang, He, Lian, Tang, Weigang, Wang, Yongsheng, Chen, Rong, Hu, Chenglu, Ma, Xiao, Shen, Hangyan
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10052919/
https://www.ncbi.nlm.nih.gov/pubmed/36984371
http://dx.doi.org/10.3390/ma16062492

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10052919/
https://www.ncbi.nlm.nih.gov/pubmed/36984371
http://dx.doi.org/10.3390/ma16062492

Ejemplares similares