Improving Thermal Conductivity and Tribological Performance of Polyimide by Filling Cu, CNT, and Graphene

The thermal conductivity, mechanical, and tribological properties of polyimide (PI) composites filled by copper (Cu), carbon nanotube (CNT), graphene nanosheet (GNS), or combination were investigated by molecular dynamics simulation (MD). The simulated results suggested that Cu can improve thermal s...

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Detalles Bibliográficos
Autores principales: Liu, Chen, Song, Jingfu, Zhao, Gai, Yin, Yuhang, Ding, Qingjun
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10053350/
https://www.ncbi.nlm.nih.gov/pubmed/36985023
http://dx.doi.org/10.3390/mi14030616

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10053350/
https://www.ncbi.nlm.nih.gov/pubmed/36985023
http://dx.doi.org/10.3390/mi14030616

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