Low-Temperature Sintering of Ag Composite Pastes with Different Metal Organic Decomposition Additions

Rapid developments in wide-bandgap semiconductors have led to the demand for interconnection materials that can withstand harsh conditions. In this study, novel Ag composite pastes were developed with the assistance of metal organic decomposition (MOD) to significantly reduce the sintering temperatu...

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Detalles Bibliográficos
Autores principales: Xu, Zixuan, Liu, Xun, Li, Junjie, Sun, Rong, Liu, Li
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10058562/
https://www.ncbi.nlm.nih.gov/pubmed/36984220
http://dx.doi.org/10.3390/ma16062340

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10058562/
https://www.ncbi.nlm.nih.gov/pubmed/36984220
http://dx.doi.org/10.3390/ma16062340

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