Self-Adaption of the GIDL Erase Promotes Stacking More Layers in 3D NAND Flash

The bit density is generally increased by stacking more layers in 3D NAND Flash. Gate-induced drain leakage (GIDL) erase is a critical enabler in the future development of 3D NAND Flash. The relationship between the drain-to-body potential (V(db)) of GIDL transistors and the increasing number of layers was studied to explain the reason for the self-adaption of the GIDL erase. The dynamics controlled by the drain-to-body and drain-to-gate potential contribute to the self-adaption of the GIDL erase. Increasing the number of layers leads to a longer duration of the maximum value of V(db) (V(db_max)), combined with the increased drain-to-gate potential, which enhances the GIDL current and further boosts channel potential to reach the same value at different positions of the NAND string. We proposed a method based on the correlation between the duration of V(db_max) and the number of layers to obtain the limited layers of the GIDL erase. The limited layers allowed are more than four times the number of layers used in the current simulation. Combining the novel method of dividing the channel into multi-regions with the asynchronous GIDL erase method will be useful for further stacking more layers in 3D NAND Flash.