Depth profiling and standardization from the back side of a sample for accurate analyses: Emphasis on quantifying low‐fluence, shallow implants in diamond‐like carbon

RATIONALE: Back‐side thinning of wafers is used to eliminate issues with transient sputtering when analyzing near‐surface element distributions. Precise and accurate calibrated implants are created by including a standard reference material during the implantation. Combining these methods allows acc...

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Detalles Bibliográficos
Autores principales: Rieck, Karen D., Jurewicz, Amy J. G., Hervig, Richard L., Williams, Peter, Olinger, Chad T., Wiens, Roger C., Ogliore, Ryan C.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: John Wiley and Sons Inc. 2023
Materias:
Research Articles
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10078471/
https://www.ncbi.nlm.nih.gov/pubmed/36477973
http://dx.doi.org/10.1002/rcm.9454

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10078471/
https://www.ncbi.nlm.nih.gov/pubmed/36477973
http://dx.doi.org/10.1002/rcm.9454

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