Toughening Thermoelectric Materials: From Mechanisms to Applications

With the tendency of thermoelectric semiconductor devices towards miniaturization, integration, and flexibility, there is an urgent need to develop high-performance thermoelectric materials. Compared with the continuously enhanced thermoelectric properties of thermoelectric materials, the understand...

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Detalles Bibliográficos
Autores principales: Wu, Luoqi, Feng, Xiaobin, Cao, Ke, Li, Guodong
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Review
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10093950/
https://www.ncbi.nlm.nih.gov/pubmed/37047298
http://dx.doi.org/10.3390/ijms24076325

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10093950/
https://www.ncbi.nlm.nih.gov/pubmed/37047298
http://dx.doi.org/10.3390/ijms24076325

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