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Toughening Thermoelectric Materials: From Mechanisms to Applications
With the tendency of thermoelectric semiconductor devices towards miniaturization, integration, and flexibility, there is an urgent need to develop high-performance thermoelectric materials. Compared with the continuously enhanced thermoelectric properties of thermoelectric materials, the understand...
Autores principales: | Wu, Luoqi, Feng, Xiaobin, Cao, Ke, Li, Guodong |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2023
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10093950/ https://www.ncbi.nlm.nih.gov/pubmed/37047298 http://dx.doi.org/10.3390/ijms24076325 |
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