The Effects of Friction and Temperature in the Chemical–Mechanical Planarization Process

Chemical–mechanical planarization (CMP) represents the preferred technology in which both chemical and mechanical interactions are combined to achieve global planarization/polishing of wafer surfaces (wafer patterns from metal with a selective layer, in this paper). CMP is a complex process of mater...

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Detalles Bibliográficos
Autores principales: Ilie, Filip, Minea, Ileana-Liliana, Cotici, Constantin Daniel, Hristache, Andrei-Florin
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10095230/
https://www.ncbi.nlm.nih.gov/pubmed/37048844
http://dx.doi.org/10.3390/ma16072550

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10095230/
https://www.ncbi.nlm.nih.gov/pubmed/37048844
http://dx.doi.org/10.3390/ma16072550

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