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The Effects of Friction and Temperature in the Chemical–Mechanical Planarization Process
Chemical–mechanical planarization (CMP) represents the preferred technology in which both chemical and mechanical interactions are combined to achieve global planarization/polishing of wafer surfaces (wafer patterns from metal with a selective layer, in this paper). CMP is a complex process of mater...
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2023
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10095230/ https://www.ncbi.nlm.nih.gov/pubmed/37048844 http://dx.doi.org/10.3390/ma16072550 |