Measurements and Modelling of Thermally Induced Warpages of DIMM Socket Server PCB Assembly after Solder Reflow Processes

The thermal warpage of a server-computer-used DIMM socket-PCB assembly after the solder reflow process is studied experimentally, theoretically, and numerically, especially along the socket lines and over the entire assembly. Strain gauge and shadow moiré are used for determining the coefficients of...

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Detalles Bibliográficos
Autores principales: Tsai, Ming-Yi, Wang, Yu-Wen, Lu, Yen-Jui, Lu, Tzu-Min, Chung, Shu-Tan
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10142018/
https://www.ncbi.nlm.nih.gov/pubmed/37110068
http://dx.doi.org/10.3390/ma16083233

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10142018/
https://www.ncbi.nlm.nih.gov/pubmed/37110068
http://dx.doi.org/10.3390/ma16083233

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