Study on Manufacturing Technology of Ultra-Thin/Narrow Bonding Cu Strip for Electronic Packaging

The performance of rolling parameters and annealing processes on the microstructure and properties of Cu strip were studied by High Precision Rolling Mill, FIB, SEM, Strength Tester, and Resistivity Tester. The results show that with the increase of the reduction rate, coarse grains in the bonding C...

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Detalles Bibliográficos
Autores principales: Cao, Jun, Zhang, Junchao, Wu, Baoan, Tang, Huiyi, Ding, Yong, Song, Kexing, Yang, Guannan, Cui, Chengqiang
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10142981/
https://www.ncbi.nlm.nih.gov/pubmed/37421071
http://dx.doi.org/10.3390/mi14040838

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10142981/
https://www.ncbi.nlm.nih.gov/pubmed/37421071
http://dx.doi.org/10.3390/mi14040838

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