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Study on Manufacturing Technology of Ultra-Thin/Narrow Bonding Cu Strip for Electronic Packaging
The performance of rolling parameters and annealing processes on the microstructure and properties of Cu strip were studied by High Precision Rolling Mill, FIB, SEM, Strength Tester, and Resistivity Tester. The results show that with the increase of the reduction rate, coarse grains in the bonding C...
| Autores principales: | , , , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2023
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10142981/ https://www.ncbi.nlm.nih.gov/pubmed/37421071 http://dx.doi.org/10.3390/mi14040838 |