Extracting and Analyzing the S-Parameters of Vertical Interconnection Structures in 3D Glass Packaging

In order to effectively employ through-glass vias (TGVs) for high-frequency software package design, it is crucial to accurately characterize the S-parameters of vertical interconnection structures in 3D glass packaging. A methodology is proposed for the extraction of precise S-parameters using the...

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Detalles Bibliográficos
Autores principales: Liu, Jinxu, Zhang, Jihua, Gao, Libin, Chen, Hongwei
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Communication
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10144001/
https://www.ncbi.nlm.nih.gov/pubmed/37421035
http://dx.doi.org/10.3390/mi14040803

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10144001/
https://www.ncbi.nlm.nih.gov/pubmed/37421035
http://dx.doi.org/10.3390/mi14040803

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