Cargando…
Extracting and Analyzing the S-Parameters of Vertical Interconnection Structures in 3D Glass Packaging
In order to effectively employ through-glass vias (TGVs) for high-frequency software package design, it is crucial to accurately characterize the S-parameters of vertical interconnection structures in 3D glass packaging. A methodology is proposed for the extraction of precise S-parameters using the...
| Autores principales: | , , , |
|---|---|
| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2023
|
| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10144001/ https://www.ncbi.nlm.nih.gov/pubmed/37421035 http://dx.doi.org/10.3390/mi14040803 |