Cargando…
Improving the Thickness Uniformity of Micro Gear by Multi-Step, Self-Aligned Lithography and Electroforming
The thickness nonuniformity of an electroformed layer is a bottleneck problem for electroformed micro metal devices. In this paper, a new fabrication method is proposed to improve the thickness uniformity of micro gear, which is the key element of various microdevices. The effect of the thickness of...
Autores principales: | Wang, Huan, Xie, Jing, Fan, Tao, Sun, Dapeng, Li, Chaobo |
---|---|
Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2023
|
Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10144376/ https://www.ncbi.nlm.nih.gov/pubmed/37421007 http://dx.doi.org/10.3390/mi14040775 |
Ejemplares similares
-
An Effect of Layered Auxiliary Cathode on Thickness Uniformity in Micro Electroforming Process
por: Wang, Huan, et al.
Publicado: (2023) -
Study on Improving Thickness Uniformity of Microfluidic Chip Mold in the Electroforming Process
por: Du, Liqun, et al.
Publicado: (2016) -
Novel Electroforming-Free Nanoscaffold Memristor with Very High Uniformity, Tunability, and Density
por: Lee, Shinbuhm, et al.
Publicado: (2014) -
Self-Aligned Colloidal Lithography for Controllable and Tuneable Plasmonic Nanogaps
por: Ding, Tao, et al.
Publicado: (2015) -
Fabrication of a Metal Micro Mold by Using Pulse Micro Electroforming
por: Chen, Xiaolei, et al.
Publicado: (2018)