Development and Research of the Sensitive Element of the MEMS Gyroscope Manufactured Using SOI Technology

In this article, based on the developed methodology, the stages of designing the sensitive element of a microelectromechanical gyroscope with an open-loop structure are considered. This structure is intended for use in control units for mobile objects such as robots, mobile trolleys, etc. To quickly obtain a ready-made gyroscope, a specialized integrated circuit (SW6111) was selected, for the use of which the electronic part of the sensitive element of the microelectromechanical gyroscope was developed. The mechanical structure was also taken from a simple design. The simulation of the mathematical model was carried out in the MATLAB/Simulink software environment. The mechanical elements and the entire structure were calculated using finite element modeling with ANSYS MultiPhysics CAD tools. The developed sensitive element of the micromechanical gyroscope was manufactured using bulk micromachining technology−silicon-on-insulator−with a structural layer thickness equal to 50 [Formula: see text] m. Experimental studies were carried out using a scanning electron microscope and a contact profilometer. Dynamic characteristics were measured using a Polytec MSA-500 microsystem analyzer. The manufactured structure has low topological deviations. Calculations and experiments showed fairly accurate results for the dynamic characteristics, with an error of less than 3% for the first iteration of the design.