Study of Bond Formation in Ceramic and Composite Materials Ultrasonically Soldered with Bi–Ag–Mg-Type Solder

This research aimed to study a Bi–Ag–Mg soldering alloy and the direct soldering of Al(2)O(3) ceramics and Ni–SiC composites. Bi11Ag1Mg solder has a broad melting interval, which mainly depends on the silver and magnesium content. The solder starts to melt at a temperature of 264 °C. Full fusion ter...

Descripción completa

Detalles Bibliográficos
Autores principales: Kolenak, Roman, Melus, Tomas, Drapala, Jaromir, Gogola, Peter, Pasak, Matej
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10145391/
https://www.ncbi.nlm.nih.gov/pubmed/37109827
http://dx.doi.org/10.3390/ma16082991

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10145391/
https://www.ncbi.nlm.nih.gov/pubmed/37109827
http://dx.doi.org/10.3390/ma16082991

Ejemplares similares