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Single Layer Lift-Off of CSAR62 for Dense Nanostructured Patterns

Lift-off processing is a common method of pattern transfer for different nanofabrication applications. With the emergence of chemically amplified and semi-amplified resist systems, the possibilities for pattern definition via electron beam lithography has been widened. We report a reliable and simpl...

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Detalles Bibliográficos
Autores principales: Ohlin, Hanna, Frisk, Thomas, Vogt, Ulrich
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10145479/
https://www.ncbi.nlm.nih.gov/pubmed/37420999
http://dx.doi.org/10.3390/mi14040766
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author Ohlin, Hanna
Frisk, Thomas
Vogt, Ulrich
author_facet Ohlin, Hanna
Frisk, Thomas
Vogt, Ulrich
author_sort Ohlin, Hanna
collection PubMed
description Lift-off processing is a common method of pattern transfer for different nanofabrication applications. With the emergence of chemically amplified and semi-amplified resist systems, the possibilities for pattern definition via electron beam lithography has been widened. We report a reliable and simple lift-off process for dense nanostructured pattern in CSAR62. The pattern is defined in a single layer CSAR62 resist mask for gold nanostructures on silicon. The process offers a slimmed down pathway for pattern definition of dense nanostructures with varied feature size and an up to 10 nm thick gold layer. The resulting patterns from this process have been successfully used in metal assisted chemical etching applications.
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spelling pubmed-101454792023-04-29 Single Layer Lift-Off of CSAR62 for Dense Nanostructured Patterns Ohlin, Hanna Frisk, Thomas Vogt, Ulrich Micromachines (Basel) Article Lift-off processing is a common method of pattern transfer for different nanofabrication applications. With the emergence of chemically amplified and semi-amplified resist systems, the possibilities for pattern definition via electron beam lithography has been widened. We report a reliable and simple lift-off process for dense nanostructured pattern in CSAR62. The pattern is defined in a single layer CSAR62 resist mask for gold nanostructures on silicon. The process offers a slimmed down pathway for pattern definition of dense nanostructures with varied feature size and an up to 10 nm thick gold layer. The resulting patterns from this process have been successfully used in metal assisted chemical etching applications. MDPI 2023-03-29 /pmc/articles/PMC10145479/ /pubmed/37420999 http://dx.doi.org/10.3390/mi14040766 Text en © 2023 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Ohlin, Hanna
Frisk, Thomas
Vogt, Ulrich
Single Layer Lift-Off of CSAR62 for Dense Nanostructured Patterns
title Single Layer Lift-Off of CSAR62 for Dense Nanostructured Patterns
title_full Single Layer Lift-Off of CSAR62 for Dense Nanostructured Patterns
title_fullStr Single Layer Lift-Off of CSAR62 for Dense Nanostructured Patterns
title_full_unstemmed Single Layer Lift-Off of CSAR62 for Dense Nanostructured Patterns
title_short Single Layer Lift-Off of CSAR62 for Dense Nanostructured Patterns
title_sort single layer lift-off of csar62 for dense nanostructured patterns
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10145479/
https://www.ncbi.nlm.nih.gov/pubmed/37420999
http://dx.doi.org/10.3390/mi14040766
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