Microstructure-driven electrical conductivity optimization in additively manufactured microscale copper interconnects

As the microelectronics field pushes to increase device density through downscaling component dimensions, various novel micro- and nano-scale additive manufacturing technologies have emerged to expand the small scale design space. These techniques offer unprecedented freedom in designing 3D circuitr...

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Detalles Bibliográficos
Autores principales: Menétrey, Maxence, van Nisselroy, Cathelijn, Xu, Mengjia, Hengsteler, Julian, Spolenak, Ralph, Zambelli, Tomaso
Formato: Online Artículo Texto
Lenguaje:English
Publicado: The Royal Society of Chemistry 2023
Materias:
Chemistry
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10155493/
https://www.ncbi.nlm.nih.gov/pubmed/37152573
http://dx.doi.org/10.1039/d3ra00611e

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10155493/
https://www.ncbi.nlm.nih.gov/pubmed/37152573
http://dx.doi.org/10.1039/d3ra00611e

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