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Microstructure-driven electrical conductivity optimization in additively manufactured microscale copper interconnects
As the microelectronics field pushes to increase device density through downscaling component dimensions, various novel micro- and nano-scale additive manufacturing technologies have emerged to expand the small scale design space. These techniques offer unprecedented freedom in designing 3D circuitr...
Autores principales: | Menétrey, Maxence, van Nisselroy, Cathelijn, Xu, Mengjia, Hengsteler, Julian, Spolenak, Ralph, Zambelli, Tomaso |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
The Royal Society of Chemistry
2023
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10155493/ https://www.ncbi.nlm.nih.gov/pubmed/37152573 http://dx.doi.org/10.1039/d3ra00611e |
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