Sputtered anti-reflection layer on transparent polyimide substrate improves adhesion strength to copper layer: effects of layer thickness and sputtering power

In order to shield the electronic circuits on a transparent polyimide (PI) substrate, an anti-reflection (AR) layer was deposited on a PI film via DC reactive magnetron sputtering. The effects of sputtering power and thickness of AR layer on the optical property and adhesion strength of the PI were...

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Detalles Bibliográficos
Autores principales: Tsai, Yuan-Nan, Chin, Shih-Chieh, Chen, Hsin-Yo, Yang, Ta-I., Tsai, Mei-Hui, Tseng, I.-Hsiang
Formato: Online Artículo Texto
Lenguaje:English
Publicado: The Royal Society of Chemistry 2023
Materias:
Chemistry
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10162370/
https://www.ncbi.nlm.nih.gov/pubmed/37152568
http://dx.doi.org/10.1039/d3ra02148c

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10162370/
https://www.ncbi.nlm.nih.gov/pubmed/37152568
http://dx.doi.org/10.1039/d3ra02148c

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