Temperature resistant anti-reflective coating on Si-wafer for long-wave infra-red imaging

A micromachined Silicon lid, sealed by CuSn solid liquid interdiffusion bonding is a promising approach for hermetic sealing of microbolometers for use in low-cost thermal cameras. However, since ∼30% of long-wave infrared light is reflected at an uncoated single Si-air interface, anti-reflective tr...

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Detalles Bibliográficos
Autores principales: Papatzacos, Phillip H., Akram, M. Nadeem, Hector, Olivier, Lemarquis, Frédéric, Moreau, Antonin, Lumeau, Julien, Ohlckers, Per
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Elsevier 2023
Materias:
Research Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10172777/
https://www.ncbi.nlm.nih.gov/pubmed/37180893
http://dx.doi.org/10.1016/j.heliyon.2023.e15888

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10172777/
https://www.ncbi.nlm.nih.gov/pubmed/37180893
http://dx.doi.org/10.1016/j.heliyon.2023.e15888

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