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Temperature resistant anti-reflective coating on Si-wafer for long-wave infra-red imaging
A micromachined Silicon lid, sealed by CuSn solid liquid interdiffusion bonding is a promising approach for hermetic sealing of microbolometers for use in low-cost thermal cameras. However, since ∼30% of long-wave infrared light is reflected at an uncoated single Si-air interface, anti-reflective tr...
| Autores principales: | , , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Elsevier
2023
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10172777/ https://www.ncbi.nlm.nih.gov/pubmed/37180893 http://dx.doi.org/10.1016/j.heliyon.2023.e15888 |