Exploring the Influence of Material Properties of Epoxy Molding Compound on Wafer Warpage in Fan-Out Wafer-Level Packaging

This study investigated the impact of material properties of epoxy molding compounds on wafer warpage in fan-out wafer-level packaging. As there is currently a lack of comprehensive discussion on the various material property parameters of EMC materials, it is essential to identify the critical infl...

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Detalles Bibliográficos
Autores principales: Chuang, Wan-Chun, Huang, Yi, Chen, Po-En
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10179932/
https://www.ncbi.nlm.nih.gov/pubmed/37176364
http://dx.doi.org/10.3390/ma16093482

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10179932/
https://www.ncbi.nlm.nih.gov/pubmed/37176364
http://dx.doi.org/10.3390/ma16093482

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