Cargando…

Exploring the Influence of Material Properties of Epoxy Molding Compound on Wafer Warpage in Fan-Out Wafer-Level Packaging

This study investigated the impact of material properties of epoxy molding compounds on wafer warpage in fan-out wafer-level packaging. As there is currently a lack of comprehensive discussion on the various material property parameters of EMC materials, it is essential to identify the critical infl...

Descripción completa

Detalles Bibliográficos
Autores principales:	Chuang, Wan-Chun, Huang, Yi, Chen, Po-En
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2023
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10179932/ https://www.ncbi.nlm.nih.gov/pubmed/37176364 http://dx.doi.org/10.3390/ma16093482

Ejemplares similares

Investigation of Warpage for Multi-Die Fan-Out Wafer-Level Packaging Process
por: Chen, Chuan, et al.
Publicado: (2022)

Advances in embedded and fan-out wafer level packaging technologies
por: Keser, Beth, et al.
Publicado: (2019)

Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration
por: Braun, Tanja, et al.
Publicado: (2019)

Three-Dimensional Integrated Fan-Out Wafer-Level Package Micro-Bump Electromigration Study
por: Tian, Wenchao, et al.
Publicado: (2023)

A New Approach for the Control and Reduction of Warpage and Residual Stresses in Bonded Wafer
por: Farshchi Yazdi, Seyed Amir Fouad, et al.
Publicado: (2021)

On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers
por: Roshanghias, Ali, et al.
Publicado: (2020)

Wafer-Level Vacuum Packaging of Smart Sensors
por: Hilton, Allan, et al.
Publicado: (2016)

Influence of the Mold Material on the Injection Molding Cycle Time and Warpage Depending on the Polymer Processed
por: Lucyshyn, Thomas, et al.
Publicado: (2021)

An Experimental and Numerical Study on Glass Frit Wafer-to-Wafer Bonding
por: Farshchi Yazdi, Seyed Amir Fouad, et al.
Publicado: (2023)

Research on Wafer-Level MEMS Packaging with Through-Glass Vias
por: Yang, Fan, et al.
Publicado: (2018)

Glass Frit Jetting for Advanced Wafer-Level Hermetic Packaging
por: Roshanghias, Ali, et al.
Publicado: (2022)

Handbook of wafer bonding
por: Ramm, Peter, et al.
Publicado: (2011)

Wafer-Level Self-Packaging Design and Fabrication of MEMS Capacitive Pressure Sensors
por: Wan, Yuanjie, et al.
Publicado: (2022)

Wafer-level chip-scale packaging: analog and power semiconductor applications
por: Qu, Shichun, et al.
Publicado: (2015)

CMOS-MEMS Test-Key for Extracting Wafer-Level Mechanical Properties
por: Chuang, Wan-Chun, et al.
Publicado: (2012)

Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding
por: Bleiker, Simon J., et al.
Publicado: (2016)

Research on Motion Control and Wafer-Centering Algorithm of Wafer-Handling Robot in Semiconductor Manufacturing
por: Han, Bing-Yuan, et al.
Publicado: (2023)

AVAILABILITY OF WAFERS OF ASIC ELECTRONICS
por: Valerio, Re
Publicado: (2012)

WAFER POSTPROCESSING (THINNING, TSV)
por: Moser, Hans-Gunther
Publicado: (2013)

Wafer bonding: applications and technology
por: Alexe, Marin, et al.
Publicado: (2004)

FBK wafer meeting, Milan
Publicado: (2019)

Compensation Method for Die Shift Caused by Flow Drag Force in Wafer-Level Molding Process
por: Yeon, Simo, et al.
Publicado: (2016)

Large Out-of-Plane Displacement Bistable Electromagnetic Microswitch on a Single Wafer
por: Miao, Xiaodan, et al.
Publicado: (2016)

On-wafer microwave measurements and de-embedding
por: Lourandakis, Errikos
Publicado: (2016)

Handbook of silicon wafer cleaning technology
por: Reinhardt, Karen, et al.
Publicado: (2018)

Ranking routes in semiconductor wafer fabs
por: Gupta, Shreya, et al.
Publicado: (2023)

Large-area integration of two-dimensional materials and their heterostructures by wafer bonding
por: Quellmalz, Arne, et al.
Publicado: (2021)

Pressure Analysis of Dynamic Injection Molding and Process Parameter Optimization for Reducing Warpage of Injection Molded Products
por: Wang, Xinyu, et al.
Publicado: (2017)

Study on the Strip Warpage Issues Encountered in the Flip-Chip Process
por: Chuang, Wan-Chun, et al.
Publicado: (2022)

Wafer-Level Packaging Method for RF MEMS Applications Using Pre-Patterned BCB Polymer
por: Gong, Zhuhao, et al.
Publicado: (2018)

Wafer-Level Vacuum-Packaged Translatory MEMS Actuator with Large Stroke for NIR-FT Spectrometers
por: Sandner, Thilo, et al.
Publicado: (2020)

Efficiency Improvement of HIT Solar Cells on p-Type Si Wafers
por: Wei, Chun-You, et al.
Publicado: (2013)

Reliability Evaluation of Fan-Out Type 3D Packaging-On-Packaging
por: Wang, Pao-Hsiung, et al.
Publicado: (2021)

Wavelength-Conversion-Material-Mediated Semiconductor Wafer Bonding for Smart Optoelectronic Interconnects
por: Kishibe, Kodai, et al.
Publicado: (2019)

Mask layout of multi-project wafer runs
por: Vila, Ivan, et al.
Publicado: (2017)

Micro-spectroscopy on silicon wafers and solar cells
por: Gundel, Paul, et al.
Publicado: (2011)

Wafer Screening of ABCN-25 readout ASIC
por: Phillips, Peter W, et al.
Publicado: (2009)

Semiconductor industry: wafer fab exhaust management
por: Sherer, Michael J
Publicado: (2005)

Wafer of Intel Pentium 4 Prescott Chips
Publicado: (2017)

Controllable Sliding Transfer of Wafer‐Size Graphene
por: Lu, Wenjing, et al.
Publicado: (2016)

Cannot write session to /tmp/vufind_sessions/sess_akuk97pslgc0jurj25lljbqa5u