Wafer map failure pattern classification using geometric transformation-invariant convolutional neural network

Wafer map defect pattern classification is essential in semiconductor manufacturing processes for increasing production yield and quality by providing key root-cause information. However, manual diagnosis by field experts is difficult in large-scale production situations, and existing deep-learning...

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Detalles Bibliográficos
Autores principales: Jeong, Iljoo, Lee, Soo Young, Park, Keonhyeok, Kim, Iljeok, Huh, Hyunsuk, Lee, Seungchul
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10199043/
https://www.ncbi.nlm.nih.gov/pubmed/37208344
http://dx.doi.org/10.1038/s41598-023-34147-2

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10199043/
https://www.ncbi.nlm.nih.gov/pubmed/37208344
http://dx.doi.org/10.1038/s41598-023-34147-2

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