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Wafer map failure pattern classification using geometric transformation-invariant convolutional neural network
Wafer map defect pattern classification is essential in semiconductor manufacturing processes for increasing production yield and quality by providing key root-cause information. However, manual diagnosis by field experts is difficult in large-scale production situations, and existing deep-learning...
| Autores principales: | , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Nature Publishing Group UK
2023
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10199043/ https://www.ncbi.nlm.nih.gov/pubmed/37208344 http://dx.doi.org/10.1038/s41598-023-34147-2 |