Preparation and Properties of Hollow Glass Microspheres/Dicyclopentadiene Phenol Epoxy Resin Composite Materials

With the development of the integrated circuit and chip industry, electronic products and their components are becoming increasingly miniaturized, high-frequency, and low-loss. These demand higher requirements for the dielectric properties and other aspects of epoxy resins to develop a novel epoxy r...

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Detalles Bibliográficos
Autores principales: Lu, Jiadong, Zhang, Songli, Zhang, Leizhi, Wang, Chenxi, Min, Chunying
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10220926/
https://www.ncbi.nlm.nih.gov/pubmed/37241395
http://dx.doi.org/10.3390/ma16103768

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10220926/
https://www.ncbi.nlm.nih.gov/pubmed/37241395
http://dx.doi.org/10.3390/ma16103768

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