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Preparation and Properties of Hollow Glass Microspheres/Dicyclopentadiene Phenol Epoxy Resin Composite Materials

With the development of the integrated circuit and chip industry, electronic products and their components are becoming increasingly miniaturized, high-frequency, and low-loss. These demand higher requirements for the dielectric properties and other aspects of epoxy resins to develop a novel epoxy r...

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Detalles Bibliográficos
Autores principales: Lu, Jiadong, Zhang, Songli, Zhang, Leizhi, Wang, Chenxi, Min, Chunying
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10220926/
https://www.ncbi.nlm.nih.gov/pubmed/37241395
http://dx.doi.org/10.3390/ma16103768
_version_ 1785049334132244480
author Lu, Jiadong
Zhang, Songli
Zhang, Leizhi
Wang, Chenxi
Min, Chunying
author_facet Lu, Jiadong
Zhang, Songli
Zhang, Leizhi
Wang, Chenxi
Min, Chunying
author_sort Lu, Jiadong
collection PubMed
description With the development of the integrated circuit and chip industry, electronic products and their components are becoming increasingly miniaturized, high-frequency, and low-loss. These demand higher requirements for the dielectric properties and other aspects of epoxy resins to develop a novel epoxy resin system that meets the needs of current development. This paper employs ethyl phenylacetate cured dicyclopentadiene phenol (DCPD) epoxy resin as the matrix and incorporates KH550 coupling-agent-treated SiO(2) hollow glass microspheres to produce composite materials with low dielectric, high heat resistance, and high modulus. These materials are applied as insulation films for high density interconnect (HDI) and substrate-like printed circuit board (SLP) boards. The Fourier transform infrared spectroscopy (FTIR) technique was used to characterize the reaction between the coupling agent and HGM, as well as the curing reaction between the epoxy resin and ethyl phenylacetate. The curing process of the DCPD epoxy resin system was determined using differential scanning calorimetry (DSC). The various properties of the composite material with different HGM contents were tested, and the mechanism of the impact of HGM on the properties of the composite material was discussed. The results indicate that the prepared epoxy resin composite material exhibits good comprehensive performance when the HGM content is 10 wt.%. The dielectric constant at 10 MHz is 2.39, with a dielectric loss of 0.018. The thermal conductivity is 0.1872 Wm(−1) k(−1), the coefficient of thermal expansion is 64.31 ppm/K, the glass transition temperature is 172 °C, and the elastic modulus is 1221.13 MPa.
format Online
Article
Text
id pubmed-10220926
institution National Center for Biotechnology Information
language English
publishDate 2023
publisher MDPI
record_format MEDLINE/PubMed
spelling pubmed-102209262023-05-28 Preparation and Properties of Hollow Glass Microspheres/Dicyclopentadiene Phenol Epoxy Resin Composite Materials Lu, Jiadong Zhang, Songli Zhang, Leizhi Wang, Chenxi Min, Chunying Materials (Basel) Article With the development of the integrated circuit and chip industry, electronic products and their components are becoming increasingly miniaturized, high-frequency, and low-loss. These demand higher requirements for the dielectric properties and other aspects of epoxy resins to develop a novel epoxy resin system that meets the needs of current development. This paper employs ethyl phenylacetate cured dicyclopentadiene phenol (DCPD) epoxy resin as the matrix and incorporates KH550 coupling-agent-treated SiO(2) hollow glass microspheres to produce composite materials with low dielectric, high heat resistance, and high modulus. These materials are applied as insulation films for high density interconnect (HDI) and substrate-like printed circuit board (SLP) boards. The Fourier transform infrared spectroscopy (FTIR) technique was used to characterize the reaction between the coupling agent and HGM, as well as the curing reaction between the epoxy resin and ethyl phenylacetate. The curing process of the DCPD epoxy resin system was determined using differential scanning calorimetry (DSC). The various properties of the composite material with different HGM contents were tested, and the mechanism of the impact of HGM on the properties of the composite material was discussed. The results indicate that the prepared epoxy resin composite material exhibits good comprehensive performance when the HGM content is 10 wt.%. The dielectric constant at 10 MHz is 2.39, with a dielectric loss of 0.018. The thermal conductivity is 0.1872 Wm(−1) k(−1), the coefficient of thermal expansion is 64.31 ppm/K, the glass transition temperature is 172 °C, and the elastic modulus is 1221.13 MPa. MDPI 2023-05-16 /pmc/articles/PMC10220926/ /pubmed/37241395 http://dx.doi.org/10.3390/ma16103768 Text en © 2023 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Lu, Jiadong
Zhang, Songli
Zhang, Leizhi
Wang, Chenxi
Min, Chunying
Preparation and Properties of Hollow Glass Microspheres/Dicyclopentadiene Phenol Epoxy Resin Composite Materials
title Preparation and Properties of Hollow Glass Microspheres/Dicyclopentadiene Phenol Epoxy Resin Composite Materials
title_full Preparation and Properties of Hollow Glass Microspheres/Dicyclopentadiene Phenol Epoxy Resin Composite Materials
title_fullStr Preparation and Properties of Hollow Glass Microspheres/Dicyclopentadiene Phenol Epoxy Resin Composite Materials
title_full_unstemmed Preparation and Properties of Hollow Glass Microspheres/Dicyclopentadiene Phenol Epoxy Resin Composite Materials
title_short Preparation and Properties of Hollow Glass Microspheres/Dicyclopentadiene Phenol Epoxy Resin Composite Materials
title_sort preparation and properties of hollow glass microspheres/dicyclopentadiene phenol epoxy resin composite materials
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10220926/
https://www.ncbi.nlm.nih.gov/pubmed/37241395
http://dx.doi.org/10.3390/ma16103768
work_keys_str_mv AT lujiadong preparationandpropertiesofhollowglassmicrospheresdicyclopentadienephenolepoxyresincompositematerials
AT zhangsongli preparationandpropertiesofhollowglassmicrospheresdicyclopentadienephenolepoxyresincompositematerials
AT zhangleizhi preparationandpropertiesofhollowglassmicrospheresdicyclopentadienephenolepoxyresincompositematerials
AT wangchenxi preparationandpropertiesofhollowglassmicrospheresdicyclopentadienephenolepoxyresincompositematerials
AT minchunying preparationandpropertiesofhollowglassmicrospheresdicyclopentadienephenolepoxyresincompositematerials