Generating Defective Epoxy Drop Images for Die Attachment in Integrated Circuit Manufacturing via Enhanced Loss Function CycleGAN

In integrated circuit manufacturing, defects in epoxy drops for die attachments are required to be identified during production. Modern identification techniques based on vision-based deep neural networks require the availability of a very large number of defect and non-defect epoxy drop images. In...

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Detalles Bibliográficos
Autores principales: Alam, Lamia, Kehtarnavaz, Nasser
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10221190/
https://www.ncbi.nlm.nih.gov/pubmed/37430778
http://dx.doi.org/10.3390/s23104864

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10221190/
https://www.ncbi.nlm.nih.gov/pubmed/37430778
http://dx.doi.org/10.3390/s23104864

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