Experimental Study on the Influence of Wire-Saw Wear on Cutting Force and Silicon Wafer Surface

Hard and brittle materials such as monocrystalline silicon still occupy an important position in the semiconductor industry, but hard and brittle materials are difficult to process because of their physical properties. Fixed-diamond abrasive wire-saw cutting is the most widely used method for slicin...

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Detalles Bibliográficos
Autores principales: Liang, Lie, Li, Shujuan, Lan, Kehao, Yu, Ruijiang, Wang, Jiabin, Zhao, Wen
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10223077/
https://www.ncbi.nlm.nih.gov/pubmed/37241246
http://dx.doi.org/10.3390/ma16103619

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10223077/
https://www.ncbi.nlm.nih.gov/pubmed/37241246
http://dx.doi.org/10.3390/ma16103619

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