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Experimental Study on the Influence of Wire-Saw Wear on Cutting Force and Silicon Wafer Surface
Hard and brittle materials such as monocrystalline silicon still occupy an important position in the semiconductor industry, but hard and brittle materials are difficult to process because of their physical properties. Fixed-diamond abrasive wire-saw cutting is the most widely used method for slicin...
| Autores principales: | , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2023
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10223077/ https://www.ncbi.nlm.nih.gov/pubmed/37241246 http://dx.doi.org/10.3390/ma16103619 |