Wafer Surface Defect Detection Based on Background Subtraction and Faster R-CNN

Concerning the problem that wafer surface defects are easily confused with the background and are difficult to detect, a new detection method for wafer surface defects based on background subtraction and Faster R-CNN is proposed. First, an improved spectral analysis method is proposed to measure the...

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Detalles Bibliográficos
Autores principales: Zheng, Jiebing, Zhang, Tao
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10223917/
https://www.ncbi.nlm.nih.gov/pubmed/37241529
http://dx.doi.org/10.3390/mi14050905

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10223917/
https://www.ncbi.nlm.nih.gov/pubmed/37241529
http://dx.doi.org/10.3390/mi14050905

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