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Wafer Surface Defect Detection Based on Background Subtraction and Faster R-CNN
Concerning the problem that wafer surface defects are easily confused with the background and are difficult to detect, a new detection method for wafer surface defects based on background subtraction and Faster R-CNN is proposed. First, an improved spectral analysis method is proposed to measure the...
| Autores principales: | , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2023
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10223917/ https://www.ncbi.nlm.nih.gov/pubmed/37241529 http://dx.doi.org/10.3390/mi14050905 |