Performance Study of Diamond Powder-Filled Sodium Silicate-Based Thermal Conductive Adhesives

With the development of miniaturized, highly integrated, and multifunctional electronic devices, the heat flow per unit area has increased dramatically, making heat dissipation a bottleneck in the development of the electronics industry. The purpose of this study is to develop a new inorganic therma...

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Detalles Bibliográficos
Autores principales: Chen, Ming, Zhou, Zhihao, Wang, Xu, Zhao, Yangchun, Zhou, Yongmin
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10254016/
https://www.ncbi.nlm.nih.gov/pubmed/37297071
http://dx.doi.org/10.3390/ma16113937

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10254016/
https://www.ncbi.nlm.nih.gov/pubmed/37297071
http://dx.doi.org/10.3390/ma16113937

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