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Performance Study of Diamond Powder-Filled Sodium Silicate-Based Thermal Conductive Adhesives
With the development of miniaturized, highly integrated, and multifunctional electronic devices, the heat flow per unit area has increased dramatically, making heat dissipation a bottleneck in the development of the electronics industry. The purpose of this study is to develop a new inorganic therma...
| Autores principales: | , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2023
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10254016/ https://www.ncbi.nlm.nih.gov/pubmed/37297071 http://dx.doi.org/10.3390/ma16113937 |