Investigation of Microstructure and Mechanical Properties of SAC105 Solders with Sb, In, Ni, and Bi Additions

Low Ag lead-free Sn-Ag-Cu (SAC) solders have attracted great interest due to their good drop resistance, high welding reliability, and low melting point. However, low Ag may lead to the degradation of the mechanical properties. Micro-alloying is an effective approach to improving the properties of S...

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Detalles Bibliográficos
Autores principales: Gao, Yaxin, Bian, Xilei, Qiu, Xingbao, Jia, Yandong, Yi, Jun, Wang, Gang
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10254307/
https://www.ncbi.nlm.nih.gov/pubmed/37297193
http://dx.doi.org/10.3390/ma16114059

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10254307/
https://www.ncbi.nlm.nih.gov/pubmed/37297193
http://dx.doi.org/10.3390/ma16114059

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