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Investigation of Microstructure and Mechanical Properties of SAC105 Solders with Sb, In, Ni, and Bi Additions
Low Ag lead-free Sn-Ag-Cu (SAC) solders have attracted great interest due to their good drop resistance, high welding reliability, and low melting point. However, low Ag may lead to the degradation of the mechanical properties. Micro-alloying is an effective approach to improving the properties of S...
Autores principales: | Gao, Yaxin, Bian, Xilei, Qiu, Xingbao, Jia, Yandong, Yi, Jun, Wang, Gang |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2023
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10254307/ https://www.ncbi.nlm.nih.gov/pubmed/37297193 http://dx.doi.org/10.3390/ma16114059 |
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